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    For EM7455 DW5811E PN 2J05X FDD/TDD LTE CAT6 4G Module 4G Card for E7270 E7470 E7370 E5570 E5470

    • For EM7455 DW5811E PN 2J05X FDD/TDD LTE CAT6 4G Module 4G Card for E7270 E7470 E7370 E5570 E5470
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    High-concerned chemical:None
    Card Type Device:4G Card
    Application:Laptop
    Wireless Protocol:LTE
    Transmission Rate:300Mbps
    Package:Yes
    Kind:Internal
    Interface Type:NGFF
    Type:WireLess
    Certification:CE,FCC
    Model Number:EM7455 DW5811e
    Battery Included:No
    Origin:Mainland China
    warm tips: support 2016 models of the following  d e l l  machines:

     latitude 14 7000 series e7470

    latitude 12 7000 series e7270

    latitude 13 7000 series e7370

    latitude 15 5000 series e5570

    latitude 14 5000 series e5470


    description :

    em7455 is a 4g-lte cat 6 module (fdd & tdd), with a down link data rate of up to 300 mbps, primarily for europe, north and south america. support for carrier aggregation (ca) and mimo. fall back to 3g-hspa+dc with rx diversity. a gnss receiver is integrated. supported frequency bands: 4g b1-b5, b7, b8, b12, b13, b20, b25, b26, b29, b30, b41 ; 3g b1-b5, b8. form factor is m.2, 42 x 30 mm. designed for high speed industrial m2m and mobile computing solutions, the airprime® em74 series embedded modules deliver high speed connectivity on lte and hspa+ networks. based on the m.2 standard with a usb host interface, the em series modules offer an easy upgrade path to new network technologies and global access to high speed networks. the m.2 formfactor is also known as ngff (new generation form factor).
    features
    region: primarily for europe, north america, south america
    air interface: 4g-lte cat 6 (fdd & tdd) with ca (carrier aggregation) and mimo, 3g-hspa+dc with rx diversity, gnss
    4g bands: b1 (2100), b2 (1900), b3 (1800), b4 (1700), b5 (850), b7 (2600), b8 (900), b12 (700), b13 (700), b20 (800), b25 (1900), b26 (850), b29 (700), b30 (2300), b41 (2500/tdd)
    3g bands: b1 (2100), b2 (1900), b3 (1800), b4 (1700), b5 (850), b8 (900)
    peak data rate: dl 300 mbps, ul 50 mbps
    gnss (gps, glonass, beidou, galileo*): qualcomm
    form factor: m.2 module, 42 x 30 x 2.3 mm
    supply voltage: 3.3 v nominal
    operating temperature: -40°c to +85°c
    control, software and features
    control options: at commands, qmi sdk, mbim
    for optimum control the qmi sdk is recommended
    drivers: android, linux, windows
    switch networks anytime with up to three different certified firmware variants on board.
    connectors
    system connector: 75/67 position m.2
    antenna rf connector: 3x ipex mhf4 (main rf, aux rf, gps with dc bias)
    interfaces
    1x usb 3.0 and usb 2.0 high speed
    1x wake host
    1x wireless disable (main rf)
    1x wireless disable (gnss)
    1x system reset
    1x power on/off
    4x antenna control(muxed with gpio 1-3)
    3x wireless coex
    1x dynamic power control, dpr
    3x config
    1x led driver output
    2x sim interface: 1.8/3v
    1x digital audio
    audio

    optional

    digital audio: pcm/i2s
    4g: volte
    3g: circuit switched fall back (csfb voice)



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