Silver 5 High-Density Polysynthetic Silver Thermal Compound 12G/3Cc Tube

Features:
Contains 99.9% pure silver
High-Density(contains over 88% thermally conductive filler by weight)
Controlled Tripple-Phase Viscosity
Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed)
Thermal Conductance: over 300,000W/m2 degree C (0.001 inch layer)
Thermal Resistance: less than 0.0045 degree C-in2/Watt (0.001 inch layer)
Average Particle Size: less than 0.49 microns less than 0.000020 inch
Extended Temperature Limits: Peak: -50 degree C to over 180 degree C Long-Term: -50 degree C to 130 degree C
Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core