Feature:
1. TEC1-12706 semiconductor cooling plate is used, and the quality is good.
2. A complete sealing structure that isolates moisture from the air.
3. With higher reliability and better working performance.
4. Light weight, small size and easy to install.
5. Excellent DIY kit for electronic enthusiasts in semiconductor cooling applications.
Specification:
Item Type:Semiconductor Cold Plate
Semiconductor Cold Plate: TEC1-12706
Size:40 x 40 x 3.75mm / 1.57 x 1.57 x 0.15in
Internal Resistance: 2.1~2.4O
Highest Temperature Difference: Above 67°C
Rated Voltage: 12V (Vmax. 15V, Starting Current 5.8A)
Working Current: Imax. = 4~4.6A (Rated 12V)
Cooling Power: Up To 50~60 Watts
Working Environment: -55~83?
Sealing Process: Standard 704 Silicone Rubber Seal All Sides
Fan: DC 12V
Conductive module size:60 x 45 x 21mm / 2.36 x 1.77 x 0.83in
Water block size:40 x 40 x 12mm / 1.57 x 1.57 x 0.47in
Fan size:40 x 40 x 10mm / 1.57 x 1.57 x 0.39in
Package List:
1 x Thermal Module (Heat Sink)
1 x Water Block (Water)
1 x TEC1-12706 (Semiconductor Cold Plate)
1 x Thermal Grease
1 x Fan
1 x Aluminum Substrate
1 x Screw Mounting Kit
Note:
1. When the temperature is below -25 ° C, the conduction cooling module will frost.
2. TEC1-12706: One side is the cooling side and the other side is the heat sink side.
3. A heat sink or water-cooled heat sink must be installed on the heat-dissipating side; otherwise the cool sink will be burned.
4. This kit does not include DC power, please prepare it yourself.